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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX5050/D Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX5050/MPXV5050G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * 2.5% Maximum Error over 0 to 85C * Ideally suited for Microprocessor or Microcontroller-Based Systems * Temperature Compensated Over - 40 to +125C * Patented Silicon Shear Stress Strain Gauge * Durable Epoxy Unibody Element * Easy-to-Use Chip Carrier Option VS MPX5050 MPXV5050G SERIES Motorola Preferred Device INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output UNIBODY PACKAGE MPX5050D CASE 867 SMALL OUTLINE PACKAGE SURFACE MOUNT SENSING ELEMENT THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY Vout GND PINS 4, 5, AND 6 ARE NO CONNECTS FOR UNIBODY DEVICE PINS 1, 5, 6, 7, AND 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE DEVICE MPXV5050GP CASE 1369 MPX5050GP CASE 867B Figure 1. Fully Integrated Pressure Sensor Schematic MPXV5050DP CASE 1351 MPX5050DP CASE 867C N/C N/C N/C N/C 1 2 3 PIN NUMBER 1 2 3 4 N/C VS Gnd Vout 5 6 7 8 PIN NUMBER Vout Gnd VS 4 5 6 N/C N/C N/C NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. REV 6 NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Motorola Sensor Device Data (c) Motorola, Inc. 2002 1 MPX5050 MPXV5050G SERIES MAXIMUM RATINGS(NOTE) Parametrics Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 -40 to +125 -40 to +125 Unit kPa C C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Pressure Supply Range(1) Symbol POP VS Io (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR Io+ -- -- Min 0 4.75 -- 0.088 4.587 -- -- -- -- -- -- -- Typ -- 5.0 7.0 0.20 4.70 4.50 -- 90 1.0 0.1 20 "0.5 Max 50 5.25 10.0 0.313 4.813 -- "2.5 -- -- -- -- -- Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.0 Volts Full Scale Output(4) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Offset Time(8) Stability(9) NOTES: 1. 1.0kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Weight, Basic Element (Case 867) Weight, Basic Element (Case 1369) Typ 4.0 1.5 Unit grams grams 2 Motorola Sensor Device Data MPX5050 MPXV5050G SERIES Figure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5050/MPXV5050G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. OUTPUT (V) TRANSFER FUNCTION: 4.5 Vout = VS*(0.018*P+0.04) ERROR 4.0 VS = 5.0 Vdc TEMP = 0 to 85C 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 35 40 20 25 30 DIFFERENTIAL PRESSURE (kPa) 45 50 55 MAX MIN TYPICAL 5.0 Figure 2. Output versus Pressure Differential +5 V FLUORO SILICONE GEL DIE COAT WIRE BOND DIE P1 STAINLESS STEEL METAL COVER EPOXY PLASTIC CASE 1.0 mF 0.01 mF Vs IPS GND 470 pF Vout OUTPUT LEAD FRAME Motorola Sensor Device Data EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND Figure 3. Cross-Sectional Diagram (Not to Scale) Figure 4. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646. 3 MPX5050 MPXV5050G SERIES Transfer Function Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04) +/- (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V 0.25 Vdc Temperature Error Band MPX5050/MPXV5050G Series 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 Temp - 40 0 to 85 +125 Multiplier 3 1 3 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C. Pressure Error Band Error Limits for Pressure 3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 - 2.0 - 3.0 0 10 20 30 40 50 60 Pressure (in kPa) Pressure 0 to 50 kPa Error (Max) 1.25 kPa 4 Motorola Sensor Device Data MPX5050 MPXV5050G SERIES PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Motorola MPX Part Number MPX5050D MPX5050DP MPX5050GP MPXV5050GP MPXV5050DP Case Type 867 867C 867B 1369 1351 Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Part Marking pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier ORDERING INFORMATION -- UNIBODY PACKAGE (MPX5050 SERIES) MPX Series Device Type Basic Element Ported Elements Differential Differential Dual Ports Gauge Options Case Type 867 867C 867B Order Number MPX5050D MPX5050DP MPX5050GP Device Marking MPX5050D MPX5050DP MPX5050GP ORDERING INFORMATION -- SMALL OUTLINE PACKAGE (MPXV5050G SERIES) Device Type Ported Elements Side Port Dual Port Options Case No. 1369 1351 MPX Series Order No. MPXV5050GP MPXV5050DP Packing Options Trays Trays Marking MPXV5050G MPXV5050G Motorola Sensor Device Data 5 MPX5050 MPXV5050G SERIES PACKAGE DIMENSIONS UNIBODY PACKAGE C R M B -A- N PIN 1 SEATING PLANE 1 2 3 4 5 6 POSITIVE PRESSURE (P1) NOTES: 10. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 11. CONTROLLING DIMENSION: INCH. 12. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _NOM 0.475 0.495 0.430 0.450 0.090 0.105 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _NOM 12.07 12.57 10.92 11.43 2.29 2.66 L -T- G F D 6 PL 0.136 (0.005) M J S TA M STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN STYLE 3: PIN 1. 2. 3. 4. 5. 6. CASE 867-08 ISSUE N BASIC ELEMENT T R SEATING PLANE A U L V NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. MILLIMETERS MIN MAX 29.08 29.85 17.4 18.16 7.75 8.26 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.1 23.11 BSC 4.62 4.93 VOUT GROUND VCC V1 V2 VEX N Q B 1 2 3 4 5 6 Q K S P C J 0.25 M PIN 1 P TQ M G F 6X D 0.173 DIM A B C D F G J K L N P Q R S U V M TP S Q S CASE 867B-04 ISSUE F PRESSURE SIDE PORTED (AP, GP) STYLE 1: PIN 1. 2. 3. 4. 5. 6. 6 Motorola Sensor Device Data MPX5050 MPXV5050G SERIES PACKAGE DIMENSIONS-CONTINUED UNIBODY PACKAGE P 0.25 (0.010) X R PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) M TQ M -A- U W L V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 PORT #2 VACUUM (P2) N PORT #1 POSITIVE PRESSURE (P1) -Q- B PIN 1 1 2 3 4 5 6 K S C SEATING PLANE -T- -T- J SEATING PLANE G F D 6 PL 0.13 (0.005) M A M CASE 867C-05 ISSUE F PRESSURE AND VACUUM SIDES PORTED (DP) VOUT GROUND VCC V1 V2 VEX Motorola Sensor Device Data 7 MPX5050 MPXV5050G SERIES SMALL OUTLINE PACKAGE DIMENSIONS SURFACE MOUNT 2 PLACES 4 TIPS 0.008 (0.20) C A B A E e 5 4 GAGE PLANE e/2 .014 (0.35) L DETAIL G A1 D 8 1 8X F b 0.004 (0.1) M CAB B E1 NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.300 0.330 0.002 0.010 0.038 0.042 0.465 0.485 0.717 BSC 0.465 0.485 0.100 BSC 0.245 0.255 0.120 0.130 0.061 0.071 0.270 0.290 0.080 0.090 0.009 0.011 0.115 0.125 0 7 MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 18.21 BSC 11.81 12.32 2.54 BSC 6.22 6.47 3.05 3.30 1.55 1.80 6.86 7.36 2.03 2.28 0.23 0.28 2.92 3.17 0 7 T N K A 8X M P 0.004 (0.1) SEATING PLANE DETAIL G C CASE 1369-01 ISSUE O 8 Motorola Sensor Device Data MPX5050 MPXV5050G SERIES SMALL OUTLINE PACKAGE DIMENSIONS - CONTINUED SURFACE MOUNT 2 PLACES 4 TIPS 0.006 (0.15) C A B A E e 5 4 GAGE PLANE e/2 .014 (0.35) L DETAIL G A1 D 8 1 8X F b 0.004 (0.1) M CAB B E1 STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. GND +Vout Vs -Vout N/C N/C N/C N/C STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. N/C Vs GND Vout N/C N/C N/C N/C NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.370 0.390 0.002 0.010 0.038 0.042 0.465 0.485 0.680 0.700 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.270 0.290 0.160 0.180 0.009 0.011 0.110 0.130 0 7 MILLIMETERS MIN MAX 9.39 9.91 0.05 0.25 0.96 1.07 11.81 12.32 17.27 17.78 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 6.86 7.37 4.06 4.57 0.23 0.28 2.79 3.30 0 7 N T A M P 8X 0.004 (0.1) SEATING PLANE DETAIL G C K CASE 1351-01 ISSUE O Motorola Sensor Device Data 9 MPX5050 MPXV5050G SERIES NOTES 10 Motorola Sensor Device Data MPX5050 MPXV5050G SERIES NOTES Motorola Sensor Device Data 11 MPX5050 MPXV5050G SERIES Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 Technical Information Center: 1-800-521-6274 HOME PAGE: http://www.motorola.com/semiconductors/ 12 Motorola Sensor Device Data MPX5050/D |
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